Fully-auto BGA rework station ZMW-750
Fully-auto BGA rework station ZMW-750
  • Fully-auto BGA rework station ZMW-750

Fully-auto BGA rework station ZMW-750


Features
    Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
    PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the
chips,make sure the rework rate.

    Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
    Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
    High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
    Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
    Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
    High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
    Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

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Fully-auto BGA rework station ZMW-750

What a BGA rework station can do?

A BGA rework station is a machine that can be used to refinish or repair printed circuit boards (PCBs) with ball grid array (BGA) packaging and surface-mounted devices (SMDs).

1. Embedded industrial PC, three independent heating zones, Panasonic CCD camera system, high-definition touch screen dialogue interface, PLC control, multi-function integrated control, folding optical lens, can store and select temperature profiles.
2. High-precision k-type thermocouple closed-loop control and PID automatic temperature compensation system, using PLC and temperature modules and intelligent control units, can achieve a temperature control deviation of ±1°C. The external temperature measuring connector can realize the precise analysis of temperature setting and real-time temperature curve.
3. With stepping motor driver: stable, reliable, safe and efficient; with high-definition visual optical alignment system; accurate positioning of PCB board, PCB can be adjusted in X, Y, Z directions, with "5-point support" + V groove pcb bracket + universal clamp.
4. There are two operating modes in the system: Auto/Manual. Auto Mode: Auto Feeding System, Auto BGA/IC Pick and Place, Auto Positioning, Soldering and Desoldering. Manual mode: manually up/down the top gimbal, with joystick, to manually control camera movement. Both modes combine optical focusing and laser positioning to complete the process. The built-in vacuum suction cup can easily pick up the bga chip.
5. Multi-function: "Quick Positioning", "Keep Warm", "Pressure Sensor", "Instant Temperature Analysis", "Voice Warning Before Heating Completed", "HD Vision Optical Alignment", "High Precision Temperature Control", etc.
6. Laser positioning: It helps to quickly place the PCB on the center point, and has a "5-point support position", which is more convenient and accurate.
7. Movable universal clamp can prevent PCB damage on edge components, suitable for various PCB repairs.
8. High-power LED lights ensure working brightness, and different sizes of magnet nozzles are used for easy replacement and installation.
9. The three heating zones can be heated independently, they are multiple temperature controls, which can ensure the best integration of different temperature zones. Heating temperature, time, slope, cooling and vacuum can all be set and controlled in the touch screen dialog interface. At the same time, PID calculation makes the heating process control more accurate and stable.
10. 6-8 sections of temperature can be set for top heating and bottom heating (up to 16 sections), 50,000 sets of temperature curves can be stored, and can be numbered, modified and applied at any time according to different BGAs. .
11. Voice warning 5-10 seconds before the completion of heating: remind the operator to pick up the bga chip on time. After heating, the cooling fan will automatically work, and when the temperature cools down to room temperature (<45°C), the cooling system will automatically stop to prevent the heater from aging.
12. Double protection: overheat protection + emergency stop function.
13. CE certification approval.
SPECIFICATION
 
Power 6800W
Up heater power 1200W
Down heater power 1200W
IR heater power 4200W(2400W control)
Power supply (Single Phase)  AC 220V±10 50Hz
Position way Optical lens+ Vshape holder+laser positioning
Temperature control High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material High sensitive touch screen+temperature control module+PLC+step drive
PCB Size Max:550×450mm  Min: 10×10mm
Thermo-couple Ports 4pcs
Chips magnification times 2-30
PCB thickness 0.5-8mm
BGA size 0.8mm-8cm
Min.chips pitch 0.15mm
Mounting BGA weight 1000G
Mounting precision ±0.01mm
Overall dimension L670×W780×H850mm
Optical alignment lens Motor drive can move front back right left
Weight of machine About 90kg
 
Power 6800W
Up heater power 1200W
Down heater power 1200W
IR heater power 4200W(2400W control)
Power supply (Single Phase)  AC 220V±10 50Hz
Position way Optical lens+ Vshape holder+laser positioning
Temperature control High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material High sensitive touch screen+temperature control module+PLC+step drive
PCB Size Max:550×450mm  Min: 10×10mm
Thermo-couple Ports 4pcs
Chips magnification times 2-30
PCB thickness 0.5-8mm
BGA size 0.8mm-8cm
Min.chips pitch 0.15mm
Mounting BGA weight 1000G
Mounting precision ±0.01mm
Overall dimension L670×W780×H850mm
Optical alignment lens Motor drive can move front back right left
Weight of machine About 90kg

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