| Total power | 9800W |
| Upper heating power | 1600W |
| Lower heating power | 1600W |
| Infrared heating power | 6000W |
| Other power | 600W |
| power supply | Three-phase 380V, 50/60Hz |
| Targeting method | V-shaped card slot fixed PCB, laser positioning light fast positioning, through the joystick control motor can move the X and Y axes at will |
| Number of drive motors and control area | 8 (split edge control equipment heating head X and Y axis movement, alignment lens X and Y axis movement, second temperature zone heating head Z1 electric lifting, upper heating head Z axis up and down, dry lifting, suction rod rotation. |
| Whether the preheating area of the third temperature zone is movable | Yes (electric movement) |
| Whether the upper and lower heating heads can be moved as a whole | Yes (electric movement) |
| Whether the alignment lens is automatic | Yes (automatic movement or manual control movement) |
| Whether the device has a suction feeding device | Yes (standard) |
| The third temperature zone heating (preheating) method | Using German imported bright infrared heating tube (advantages: fast heating, when the equipment is heated normally, the temperature around the PCB motherboard and the temperature of the reworked chip position will not form a large temperature difference, so as to ensure that the PCB motherboard will not be deformed or twisted, which can better improve the soldering yield of the chip) |
| The second temperature zone control mode | Electric automatic lifting |
| Temperature control | High-precision K-type thermocouple (Ksensor) closed-loop control (Closed Loop), up and down independent temperature measurement Temperature control accuracy up to ±1 degrees |
| Electrical material selection | Industrial computer + 8-axis motion control board |
| PC computer control | Can be linked to MES system |
| Maximum PCB size | 750*620mm (actual effective area, no repair dead angle) |
| Minimum PCB size | 10*10mm |
| Number of temperature measurement interfaces | 5 pcs |
| The chip zooms in and out | 2-50 times |
| PCB thickness | 0.5~8mm |
| Applicable chips | 1*1~120*120mm |
| Applicable minimum chip pitch | 0.15mm |
| Maximum placement load | 1000g |
| Placement accuracy | ±0.01mm |
| Machine size | L1050*W1150*H1700mm(without stand) |
| Machine weight | APPROX. 350KG |
Please make sure your contact information is correct. Your message will be sent directly to the recipient(s) and will not be publicly displayed. We will never distribute or sell your personal information to third parties without your express permission.
