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MOTEK FUSION 3D SPI
MOTEK FUSION 3D SPI
  • MOTEK FUSION 3D SPI

MOTEK FUSION 3D SPI

High-speed inline 3D solder paste inspection (SPI).
Superior price-to-performance ratio.
High-resolution sensor technology.
User-friendly interface.
Rapid 5-minute Gerber/CAD programming.
Integrated SPC analytics.
Real-time inspection of height, area, volume, X-Y alignment
Realistic 3D rendering for accurate quality analysis.
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Product Details
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Fusion 3D's  Ultra measurement
software includes on-board SPC analytics, a
powerful tool to help operators control
important parameters of the stencil printing
process. Data collected by the system for
each desired characteristic is calculated and
charted in real-time. User-de-fined LSL, Target

Fusion 3D's  Ultra measurement
software includes on-board SPC analytics, a
powerful tool to help operators control
important parameters of the stencil printing
process. Data collected by the system for
each desired characteristic is calculated and
charted in real-time. User-de-fined LSL, Target
and USL • X-bar / R and histogram charting •
Min / Max/ Median Values • Cp/Cpk /Cr and


The LineMaster Fusion 3D collects photo realistic 3D color profiles for fast
and accurate paste analysis. Operators may use these profiles to help
them determine the most accurate corrective actions needed to
effectively resolve to the root cause of print process related defects.
Lower Z values are all part of the advanced
statistical analysis software.
and USL • X-bar / R and histogram charting •
Min / Max/ Median Values • Cp/Cpk /Cr and
Lower Z values are all part of the advanced
statistical analysis software.
Category Specification
Maximum Object Thickness 5.1 cm (2.0 inches)
Standard PCB Size 610 mm x 510 mm (24”x 20”)
Optional PCB Size System 1220mm x 610mm (48”x 24”)
PC Controller Electrical Requirements Windows 10 Pro OS 100-240 VAC, 50-60 Hz, 2 Amps
Ambient Operating Temperature 15° - 28° C (60° - 82° F)
Ambient Operating Humidity System <90%W non-condensing
Weight (un-crated) 432 Kg (950 lbs)
System Weight (crated) 545 Kg (1200 lbs)
Measurement Characteristics Height, Area, Volume, X-Y Registration Bridging, Realistic 3D Shape Detection
SPC Charting/Data Reports Fully Integrated Real-Time SPC Custom User Defined Reports
Sensor Technology Phase Shift Interferometry (PSI)
Measurement Range 441um (18.0 mils)
Integral Video Camera High Resolution CCD Camera
Field of View (FOV) 24mm x 26mm
Illumination LED-based White Light
Inspection Speed .33 Sec./FOV
Height Accuracy 1μm (0.00004”)
Gauge R&R <<10% (+/- 40% Tolerance)
Z Resolution 1.78μm (.00007”)
Lateral Resolution (X-Y) 8μm (.003”)
Minimum Paste Deposit 51μm (.002”)

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