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Panasonic NPM W2 pick and place machine
Panasonic NPM W2 pick and place machine
  • Panasonic NPM W2 pick and place machine

Panasonic NPM W2 pick and place machine

FEATURES

▶Higher productivity and quality with printing, placement and inspection process integration
▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
▶Higher area productivity through dual lane placement
▶Quick-change feeder carts and nozzle banks
▶Lightweight 16-nozzle head (for 77,000 CPH) with increased placement accuracy to 25um (cpk ≥ 1.0)
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Panasonic NPM W2 pick and place machine

PRODUCT DETAILS

The NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.

Featuring a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single system: 2D alignment, component thickness inspection, and 3D coplanarity measurement. 

Model ID NPM-W2
Rear head
Front head		 Lightweight
16-nozzle head		 12-nozzle head Lightweight
8-nozzle head		 3-nozzle head V2 Dispensing head No head
Lightweight 16-nozzle head NM-EJM7D NM-EJM7D-MD NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head NM-EJM7D-MD - NM-EJM7D-D
Inspection head NM-EJM7D-MA NM-EJM7D-A
No head NM-EJM7D NM-EJM7D-D -
PCB
dimensions
(mm)		 Single-lane*1 Batch
mounting		 L 50 x W 50 ~ L 750 x W 550
2-positin
mounting		 L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option configuration.)
Placement head Lightweight 16-nozzle head
(Per head)		 12-nozzle head
(Per head)		 Lightweight 8-nozzle head
(Per head)		 3-nozzle head V2
(Per head)
High production mode
[ON]		 High production mode
[OFF]		 High production mode
[ON]		 High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)		 35 000cph
(0.103 s/ chip)		 32 250cph
(0.112 s/ chip)		 31 250cph
(0.115 s/ chip)		 20 800cph
(0.173 s/ chip)		 8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)		 ±40 μm / chip ±30 μm / chip
(±25μm / chip)*6		 ±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
12mm Under		 ± 30 µm/QFP
Component
dimensions
(mm)		 0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply		 Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick - Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray - Single tray specifications : Max.20
Twin tray specifications : Max.40
Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time		 Solder
Inspection *10		 0.35s/ View size
Component
Inspection *10		 0.5s/ View size
Inspection
object		 Solder
Inspection *10		 Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more		 Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10		 Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
Inspection
items		 Solder
Inspection *10		 Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10		 Missing, shift, flipping, polarity, foreign object inspection *12
Inspection position accuracy *13
( Cpk1)		 ± 20 μm ± 10 μm
No. of
inspection		 Solder
Inspection *10		 Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10		 Max. 10 000 pcs./machine
*1 : Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
*2 : Only for main body
*3 : 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
*4 : Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm
*5 : Excluding the monitor, signal tower and ceiling fan cover.
*6 : ±25 μm placement support option.(Under conditions specified by PSFS)
*7 : The 03015/0402 chip requires a specific nozzle/feeder.
*8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
*9 : A PCB height measurement time of 0.5s is included.
*10 : One head cannot handle solder inspection and component inspection at the same time.
*11 : Please refer to the specification booklet for details.
*12 : Foreign object is available to chip components.(Excluding 03015 mm chip)
*13 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.

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